Research Engineer II
School of Electrical and Computer Engineering
Georgia Institute of Technology
Office: MaRC 355
Phone: 404.385.0511

Google Scholar Page for this scholar

Dr. Vanesssa Smet oversees the Interconnections & Assembly Program for the 3D Systems Packaging Research Center at Georgia Tech.

Her research spans the areas of power electronics, power integration, high temperature die-attachment, 3d packaging technologies, µbga, thermo-mechanical modeling, finite element analysis, reliability of electronic systems, power & thermal cycling, failure analysis, mechanical engineering, mechanics of micro-scale materials, multi-physics problems, and lead-free solders.

Research Areas of Interest
  • Power Electronics
  • Power Integration
  • 3D Packaging Technologies
  • Thermo-Mechanical Modeling
  • Reliability of Electronic Systems
  • Failure Analysis
  • Mechanics of Micro-Scale Materials

Expertise Keywords

Expertise Keywords

  • Power Electronics
  • 3D packaging Technologies