The assembly, packaging and reliability labs at GT-IEN house a 300 mm cleanroom package and assembly facility capable of producing leading-edge multi-functional interposers and packages from design to prototypes.  The labs were installed at a cost of more than $40M USD. The labs contain a 300mm substrate fabrication facility, assembly facility, materials research labs, electrical test areas, and environmental testing facilities. The research labs serve to enable cutting-edge research in core areas of advanced packaging technologies encompassing the complete breadth from fundamental research to functional design and demonstration test vehicles to complete engineered systems.

Center Contact

Center Director: Madhavan Swaminathan 
John Pippin Chair in Electromagnetics; Professor
Director, 3D Systems Packaging Research Center
School of Electrical and Computer Engineering | 404.894.3340